The Association of Singapore Marine Industries (ASMI) -Marine Technology Scholarship

Merit Based Scholarship | Scholarship Provided by : The Association of Singapore Marine Industries (ASMI)

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About the Scholarship

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The Association of Singapore Marine Industries (ASMI) - Marine Technology Scholarship is a merit based scholarship provided by the Association of Singapore Marine Industries (ASMI). The number of scholarships offered to students varies every year. This scholarship is provided to Singapore students for undergraduate studies at Newcastle University in United Kingdom and Singapore Institute of Technology in Singapore.

Scholarship application closes on
April 1, 2016
Scholarship provided type
Trust
Number of scholarships offered
Varies per year
Study Level
Undergraduate
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Scholarship Details

This scholarship grants up to an amount of $39500 per year. It comes with a 3-year bond to the sponsoring company. It is applicable to undergraduate students interested in Engineering and Technology. This scholarship is applicable to students from Singapore. In view of the higher tuition fees for Singapore Permanent Residents (PR) at $49,250 and in order to help those with difficulty managing the fees, there will be an option for an additional award of $9,750 with an additional 1-year bond. Hence, a successful PR candidate can opt for a $39,500 scholarship award with a 3-year bond or a $49,250 scholarship award with a 4-year bond.

Requirements

Eligibility Criteria

To be eligible for this scholarship, the
  • Student must have been offered a place to study a full-time undergraduate Marine Technology programme with SIT and its overseas university partner, and must have accepted the offer
  • Student should be a Singapore Citizen or Singapore Permanent Resident
  • Student should have good academic results in engineering
  • Student should have good leadership and communication skills.

Additional Information

Upon graduation, the student is required to serve a three-year bond with the scholarship provider or sponsor. The date of commencement of the bond is decided between the scholar and the scholarship provider at the time of the award of the scholarship.

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